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US Patent Issued to TEXAS INSTRUMENTS on July 21 for "Common mode suppression circuit" (Belarusian, American Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,447, issued on July 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Common mode suppression circuit" was invented by Siraj Akhtar (Da... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Integrated circuit device and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,448, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Integrated circuit device and electronic dev... Read More


US Patent Issued to Micron Technology on July 21 for "Memory device including source structure having conductive islands of different widths" (Idaho Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,449, issued on July 21, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory device including source structure having conductive ... Read More


US Patent Issued to Fujian Jinhua Integrated Circuit on July 21 for "Semiconductor device and fabricating method thereof" (Chinese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,450, issued on July 21, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China). "Semiconductor device and fabrica... Read More


US Patent Issued to NANYA TECHNOLOGY on July 21 for "Interconnection structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,451, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Interconnection structure and method for manufac... Read More


US Patent Issued to NANYA TECHNOLOGY on July 21 for "Semiconductor device with thickening layer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,452, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with thickening layer and m... Read More


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on July 21 for "Staircase structure in three-dimensional memory device and method for forming the same" (Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,453, issued on July 21, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Staircase structure in three-dimensional memo... Read More


US Patent Issued to Ampleon Netherlands on July 21 for "Electronic package and device comprising the same" (Dutch Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,454, issued on July 21, was assigned to Ampleon Netherlands B.V. (Nijmegen, Netherlands). "Electronic package and device comprising the sam... Read More


US Patent Issued to Murata Manufacturing on July 21 for "Semiconductor device, semiconductor module, and system" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,455, issued on July 21, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan). "Semiconductor device, semiconductor module, and s... Read More


US Patent Issued to LX SEMICON on July 21 for "Double-sided heat dissipation power semiconductor module and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,456, issued on July 21, was assigned to LX SEMICON Co. LTD (Daejeon, South Korea). "Double-sided heat dissipation power semiconductor modul... Read More